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SGH10N120RUFD
IGBT
SGH10N120RUFD
Short Circuit Rated IGBT
General Description
Fairchild's RUFD series of Insulated Gate Bipolar Transistors (IGBTs) provides low conduction and switching losses as well as short circuit ruggedness. The RUFD series is designed for applications such as motor control, uninterrupted power supplies (UPS) and general inverters where short circuit ruggedness is a required feature.
Features
* * * * * Short circuit rated 10s @ TC = 100C, VGE = 15V High speed switching Low saturation voltage : VCE(sat) = 2.3 V @ IC = 10A High input impedance CO-PAK, IGBT with FRD : trr = 65ns (typ.)
Applications
AC & DC motor controls, general purpose inverters, robotics, and servo controls.
C
G
TO-3P
GCE
E
TC = 25C unless otherwise noted
Absolute Maximum Ratings
Symbol VCES VGES IC ICM (1) IF IFM TSC PD TJ Tstg TL
Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Collector Current Pulsed Collector Current Diode Continuous Forward Current Diode Maximum Forward Current Short Circuit Withstand Time Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for soldering Purposes, 1/8" from case for 5 seconds
@ TC = 25C @ TC = 100C @ TC = 100C @ TC = 100C @ TC = 25C @ TC = 100C
SGH10N120RUFD 1200 25 16 10 30 10 60 10 125 50 -55 to +150 -55 to +150 300
Units V V A A A A A s W W C C C
Notes : (1) Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol RJC(IGBT) RJC(DIODE) RJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Typ. ---Max. 1.0 1.5 40 Units C/W C/W C/W
(c)2002 Fairchild Semiconductor Corporation
SGH10N120RUFD Rev. B2
SGH10N120RUFD
Electrical Characteristics of the IGBT T
Symbol Parameter
C
= 25C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVCES BVCES/ TJ ICES IGES Collector-Emitter Breakdown Voltage Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current G-E Leakage Current VGE = 0V, IC = 1mA VGE = 0V, IC = 1mA VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V 1200 ----0.6 ----1 100 V V/C mA nA
On Characteristics
VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage IC = 10mA, VCE = VGE IC = 10A, VGE = 15V IC = 16A, VGE = 15V 3.5 --5.5 2.3 2.8 7.5 3.0 -V V V
Dynamic Characteristics
Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz ---950 75 30 ---pF pF pF
Switching Characteristics
td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Eon Eoff Ets Tsc Qg Qge Qgc Le Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Short Circuit Withstand Time Total Gate Charge Gate-Emitter Charge Gate-Collector Charge Internal Emitter Inductance --------------10 ----20 60 60 150 0.65 0.65 1.3 20 70 80 200 0.75 1.00 1.75 -50 6 25 14 --110 300 --1.85 --150 400 --2.54 -75 9 40 -ns ns ns ns mJ mJ mJ ns ns ns ns mJ mJ mJ s nC nC nC nH
VCC = 600 V, IC = 10A, RG = 25, VGE = 15V, Inductive Load, TC = 25C
VCC = 600 V, IC = 10A, RG = 25, VGE = 15V, Inductive Load, TC = 125C
@ TC =
VCC = 600 V, VGE = 15V 100C
VCE = 600 V, IC = 10A, VGE = 15V Measured 5mm from PKG
Electrical Characteristics of DIODE T
Symbol VFM trr Irr Qrr Parameter Diode Forward Voltage Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge
C
= 25C unless otherwise noted
Test Conditions TC = 25C IF = 10A TC = 100C TC = 25C TC = 100C IF = 10A dI/ dt = 200 A/s TC = 25C TC = 100C TC = 25C TC = 100C
Min. ---------
Typ. 2.9 2.7 65 90 6.0 7.5 195 300
Max. 3.5 -100 -8.0 -400 --
Units V ns A nC
(c)2002 Fairchild Semiconductor Corporation
SGH10N120RUFD Rev. B2
SGH10N120RUFD
70 60 Common Emitter TC = 25 20V 17V
50
40
Common Emitter VGE = 15V TC = 25 TC = 125
Collector Current, IC [A]
Collector Current, IC [A]
50 40 30 20
15V
30
12V
20
VGE = 10V 10 0 0 2 4 6 8 10
10
0 0 2 4 6 8 10
Collector - Emitter Voltage, VCE [V]
Collector - Emitter Voltage, VCE [V]
Fig 1. Typical Output Characteristics
Fig 2. Typical Saturation Voltage Characteristics
3.4 3.2 Collector - Emitter Voltage, VCE [V] 3.0 2.8 2.6 2.4 2.2 IC = 10A Common Emitter VGE = 15V 16A
20 VCC = 600V Load Current : peak of square wave
Load Current [A]
10
Duty cycle : 50% 2.0 1.8 25 50 75 100 125 150 0 0.1 1 10 100 1000 TC = 100 Power Dissipation = 25W
Case Temperature, TC []
Frequency [KHz]
Fig 3. Saturation Voltage vs. Case Temperature at Variant Current Level
Fig 4. Load Current vs. Frequency
20 Common Emitter T C = 25 16
20 Common Emitter T C = 125
Collector - Emitter Voltage, V [V] CE
Collector - Emitter Voltage, VCE [V]
16
12
12
8 20A 4 I C = 5A 0 0 4 8 12 16 20
8 20A 4 IC = 5A 0 0 4 8 12 16 20
10A
10A
Gate - Emitter Voltage, V GE [V]
Gate - Emitter Voltage, V GE [V]
Fig 5. Saturation Voltage vs. VGE
(c)2002 Fairchild Semiconductor Corporation
Fig 6. Saturation Voltage vs. VGE
SGH10N120RUFD Rev. B2
SGH10N120RUFD
1500 Common Emitter VGE = 0V, f = 1MHz T C = 25
100 Common Emitter VCC = 600V, VGE = 15V IC = 10A TC = 25 TC = 125 tr td(on)
1200
Cies
900
600 Coes 300 Cres
Switching Time [ns]
10
Capacitance [pF]
0 1 10
10
100
Collector - Emitter Voltage, VCE [V]
Gate Resistance, RG []
Fig 7. Capacitance Characteristics
Fig 8. Turn-On Characteristics vs. Gate Resistance
1000 Common Emitter VCC = 600V, V GE = 15V IC = 10A T C = 25 T C = 125 Common Emitter VCC = 600V, VGE = 15V IC = 10A TC = 25 TC = 125
Switching Time [ns]
Switching Loss [J]
tf td(off) 100
1000
Eoff Eon
Eoff
10
100
10
100
Gate Resistance, RG []
Gate Resistance, RG []
Fig 9. Turn-Off Characteristics vs. Gate Resistance
Fig 10. Switching Loss vs. Gate Resistance
100 Common Emitter VGE = 15V, RG = 25 TC = 25 TC = 125 Common Emitter VGE = 15V, RG = 25 T C = 25 T C = 125
tr
Switching Time [ns]
Switching Time [ns]
tf
100
td(on)
td(off)
10 5 10 15 20 5 10 15 20
Collector Current, I C [A]
Collector Current, IC [A]
Fig 11. Turn-On Characteristics vs. Collector Current
(c)2002 Fairchild Semiconductor Corporation
Fig 12. Turn-Off Characteristics vs. Collector Current
SGH10N120RUFD Rev. B2
SGH10N120RUFD
16
Gate - Emitter Voltage, VGE [V]
Common Emitter VGE = 15V, RG = 25 TC = 25 TC = 125
14
Common Emitter R L = 60 T C = 25 600V 400V
Eoff Eon Eoff Eon
12 10 8 6 4 2 0 Vcc=200V
Switching Loss [J]
1000
100 5 10 15 20
0
10
20
30
40
50
60
Collector Current, IC [A]
Gate Charge, Q g [nC]
Fig 13. Switching Loss vs. Collector Current
Fig 14. Gate Charge Characteristics
100 IC MAX. (Pulsed) 10 IC MAX. (Continuous) 1ms DC Operation 1 100s 50s
Collector Current, I C [A]
Collector Current, Ic [A]
10
0.1
0.01 0.1
Single Nonrepetitive Pulse TC = 25 Curves must be derated linearly with increase in temperature 1 10 100 1000
1 1
Safe Operating Area VGE = 20V, T C = 100 10 100 1000
Collector - Emitter Voltage, V CE [V]
Collector - Emitter Current, VCE [V]
Fig 15. SOA Characteristics
Fig 16. Turn-Off SOA
10
Thermal Response [Zthjc]
1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01
t1 t2 Pdm
single pulse 1E-3 10
-5
Duty factor D = t1 / t2 Peak Tj = Pdm x Zthjc + TC
-4
10
10
-3
10
-2
10
-1
10
0
10
1
Rectangular Pulse Duration [sec]
Fig 17. Transient Thermal Impedance of IGBT
(c)2002 Fairchild Semiconductor Corporation SGH10N120RUFD Rev. B2
SGH10N120RUFD
50
16 14 VR = 200V IF = 10A T C = 25 T C = 100
Reverse Recovery Current, Irr [A]
6
Forward Current, IF [A]
10
12 10 8 6 4 2 0 100
1
TC = 25 TC = 100 0.1 0 2 4
500
Forward Voltage Drop, VFM [V]
di/dt [A/s]
Fig 18. Forward Characteristics
Fig 19. Reverse Recovery Current
600 VR = 200V IF = 10A TC = 25 TC = 100
140 VR = 200V IF = 10A TC = 25 TC = 100
Stored Recovery Charge, Qrr [nC]
Reverse Recovery Time, trr [ns]
500
500
120
400
100
300
80
200
100
60
0 100
40 100
500
di/dt [A/s]
di/dt [A/s]
Fig 20. Stored Charge
Fig 21. Reverse Recovery Time
(c)2002 Fairchild Semiconductor Corporation
SGH10N120RUFD Rev. B2
SGH10N120RUFD
Package Dimension
TO-3P (FS PKG CODE AF)
15.60 0.20 3.80 0.20 13.60 0.20 o3.20 0.10 9.60 0.20 4.80 0.20 1.50 -0.05
+0.15
12.76 0.20
19.90 0.20
16.50 0.30
3.00 0.20 1.00 0.20
3.50 0.20
2.00 0.20
13.90 0.20
23.40 0.20
18.70 0.20
1.40 0.20
5.45TYP [5.45 0.30]
5.45TYP [5.45 0.30]
0.60 -0.05
+0.15
Dimensions in Millimeters
(c)2002 Fairchild Semiconductor Corporation SGH10N120RUFD Rev. B2
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM
FAST(R) FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM
MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM
SLIENT SWITCHER(R) SMART STARTTM SMPTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM
UHCTM UltraFET(R) VCXTM
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness. provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
(c)2002 Fairchild Semiconductor Corporation
Rev. H5

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